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2025

A. Rao, E. Bogatin and M. Piket-May, "Metrics for Acceptable Oscilloscope Bandwidth," in IEEE Transactions on Instrumentation and Measurement, vol. 74, pp. 1-8, 2025, Art no. 2008208, doi: 10.1109/TIM.2025.3556197.
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2024

A. Rao, E. Bogatin, M. Piket-May and M. F. Hadi, "Non-TEM Dispersion in Microstrip Structures at High Data Rates," in IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 178-185, 2024, doi: .

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2023

ÌýE. Bogatin, "S-parameters for high-speed digital engineers: A beginner’s guide,"ÌýIEEE Electromagnetic Compatibility Magazine, vol. 12, no. 1, pp. 34-41, 2023. ÌýAvailable:

A. Rao, E. Bogatin, M. Piket-May and M. Hadi, "A New Perspective on Quasi-TEM Behavior in Microstrip Transmission Lines," 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, 2023, pp. 1-3, doi: 10.1109/EPEPS58208.2023.10314872.
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2022

A. Rao, E. Bogatin, M. Piket-May, D. Schofield, B. Sankarshanan, and A. Srivastava, "Analysis of a TDR technique to measure dielectric constant," inÌý2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA, Aug. 1–5, 2022, doi: 10.1109/9889566. Available:
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E. Bogatin, "What’s new in signal integrity and high-speed serial links: Approaching the fundamental limits of copper interconnects,"ÌýIEEE Microwave Magazine, vol. 23, no. 5, pp. 84-95, 2022, doi: 10.1109/MMM.2022.3148810.Ìý Available:

2021

T. W. Lee, F. de Paulis, M. Resso, M. Piket-May and E. Bogatin, "Non-destructive PCB Substrate Height Extraction with Multi-Measurement Technique," 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), Siegen, Germany, 2021, pp. 1-4, doi: . ÌýAvailable:

A. Rao, S. Sawant, E. Bogatin and M. Piket-May, "Impact of Copper Pour on Crosstalk: Measurement and Simulation Correlation," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, USA, 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609111.

F. Deek, M. Piket-May and E. Bogatin, "Novel low cost launch for measuring via-to-cavity coupling," 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA, 2021, pp. 1-3, doi: 10.1109/EDAPS53774.2021.9657023.

2019

E. Bogatin, S. Sandler, L. Smith, "Power Distribution Network (PDN) Impedance and Target Impedance," PDNpowerintegrity.com. Available: .

2018

F. Deek, M. Piket-May and E. Bogatin, "Transfer Impedance Drop off in Power/Ground Plane Cavities," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 105-109, doi: .
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L. Smith and E. Bogatin, "Principles of Power Integrity for PDN Design," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 1-74, doi: 10.1109/EMCSI.2018.8495411.Ìý

E. Bogatin, "Essential Principles of Cross Talk and Mitigation Strategies," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 1-29, doi: 10.1109/EMCSI.2018.8495242. .

2017Ìý

E. Bogatin, B. Hargin, V. S. S. T. Paladugu, D. DeGroot, A. Koul, S. Baek, and M. Sapozhnikov, "New characterization technique for glass-weave skew,"ÌýSignal Integrity Journal, Mar. 2, 2017. [Online]. Available:. Available:Ìý
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E. Bogatin and K. Radhakrishna, "Synthesis of high speed channels from shorter elements," in IEEE Electromagnetic Compatibility Magazine, vol. 6, no. 1, pp. 85-90, First Quarter 2017, doi: . Ìý Available:
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H. Barnes, E. Bogatin and J. Moreira, "Development of a PCB kit for s-parameter de-embedding algorithms verification," 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA, 2017, pp. 510-515, doi: . ÌýAvailable:
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M. Resso, E. Bogatin, and A. Vatsyayan, "A new method to verify the accuracy of de-embedding algorithms," inÌý2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3.ÌýAvailable:

2016

A. P. Duffy, G. Zhang, C. Luk, E. Bogatin and C. -C. Huang, "Assessing techniques to compare signal integrity data for high speed interconnects," 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), Ottawa, ON, Canada, 2016, pp. 455-460, doi: 10.1109/ISEMC.2016.7571691.

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2013

E. Bogatin, D. DeGroot, P. Huray, Y. Shlepnev, "Which One is Better? Comparing Options to Describe Frequency Dependent Losses" (2013). Faculty Publications. 1665.
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E. Bogatin, L. Simonovich, "Dramatic Noise Reduction using Guard Traces with Optimized Shorting Vias," [Online]. (2013). Design Con 2013. Available: .

2011

E. Bogatin, "Essential principles of signal integrity,"ÌýIEEE, 2011, ÌýAvailable:
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L. Simonovich, E. Bogatin, and Y. Cao, "Differential via modeling methodology," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 5, pp. 722-730, 2011. ÌýAvailable:

2010

A. Ciccomancini Scogna and E. Bogatin, "Analysis of return path discontinuities in multilayer PCBs and their impact on the signal and power integrity,"ÌýIEEE, 2010. Available:
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E. Bogatin,ÌýSignal and Power Integrity—Simplified, 2nd ed. Upper Saddle River, NJ, USA: Prentice Hall PTR, 2010. ISBN: 978-0-13-234979-6. ÌýAvailable:

2009

M. Resso and E. Bogatin,ÌýSignal Integrity Characterization Techniques, 2nd ed. Chicago, IL, USA: International Engineering Consortium, 2009. ISBN: 978-1-931695-93-0.Ìý Available:

2007

E. Bogatin, "Tracking transmission line losses," Printed Circuit Design & Fab, Jan. 2007. [Online]. Available: .

2004

J. Andes and E. Bogatin, "The socket response to current packaging and test trends," IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585), San Jose, CA, USA, 2004, pp. 97-99, doi: 10.1109/IEMT.2004.1321639. Ìý

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2000

E. Bogatin, "A closed-form analytical model for the electrical properties of transmission lines for digital interconnects,"ÌýIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, vol. 23, no. 3, pp. 282–289, 2000.ÌýAvailable:

1991

F. Perezalonso, B. Crawford, R. Bernard, R. Kaw, S. Thomas and E. Bogatin, "Electrical characterization of VLSI packages," 1991 Proceedings 41st Electronic Components & Technology Conference, Atlanta, GA, USA, 1991, pp. 62-69, doi: 10.1109/ECTC.1991.163855.

1990

E. Bogatin, "A closed form analytical model for the electrical properties of microstrip interconnects," in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no. 2, pp. 258-266, June 1990, doi: 10.1109/33.56155.
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1989

E. Bogatin, P. Ghandi, G. Weihe, S. Szeto, and C. Lofdahl, "Enhanced high-speed performance from HDI thin film multichip modules," Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,, San Francisco, CA, USA, 1989, pp. 103B-, doi: 10.1109/EMTS.1989.69004.

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1988

E. Bogatin, "Design rules for microstrip capacitance," in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 11, no. 3, pp. 253-259, Sept. 1988, doi: 10.1109/33.16649.
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